TL;DR
Intel 4 brings a 2x increase in density. TSMC’s cadence is slowing down due to higher complexity. ASML’s new high numerical aperture (high-NA) EUV lithography machines will reach fabs in 2024. And the air force is exploring the use of eVTOLs.
Interesting Links from Around the Web
https://www.anandtech.com/show/17448/intel-4-process-node-in-detail-2x-density-scaling-20-improved-performance: Details about the new Intel 4 process are out, with a 2x increase in density over Intel 7. Intel will need to prove it can land Intel 4 successfully to catch up with TSMC and Samsung.
https://www.anandtech.com/show/17452/tsmc-readies-five-3nm-process-technologies-with-finflex: TSMC’s new node cadence is slowing down to 2.5 years as shrinking process nodes increase R&D complexity. TSMC plans to offer multiple iterations of its 3 node reflecting different customer needs.
https://www.anandtech.com/show/17415/asmls-highna-update-coming-to-fabs-in-2024-2025: ASML’s next generation EUV lithography high-NA (numerical aperture) machine will land in fabs in 2024-2025. High-NA EUV lithography will underpin the next generation of semiconductor scaling with IMEC suggesting the technology could enable semiconductor roadmaps to scale to 1nm and beyond. Several fundamental new advances are required to enable these devices.
https://www.extremetech.com/extreme/337192-microsoft-to-store-worlds-music-collection-on-quartz-wafers: Microsoft is exploring the use of quartz for very long term storage
https://www.defensenews.com/air/2022/06/16/us-air-forces-flying-car-coming-to-an-exercise-near-you/: The air force is exploring the use of eVTOLs
https://www.defensenews.com/opinion/commentary/2022/06/15/the-defense-production-act-is-helping-rebuild-the-us-industrial-base-lets-keep-it-that-way/: An argument that the defense production act is proving a critical tool to rebuild the US industrial base.
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Author: Bharath Ramsundar, Ph.D.
Editor: Sandya Subramanian, Ph.D.